Latest Headlines

  1. SEAKR Selects Rambus SerDes And Security IP For Aerospace And Satellite Communications

    Rambus Inc., a premier silicon IP and chip provider making data faster and safer, today announced that SEAKR Engineering, a leading-edge provider of advanced electronics for space applications, selected the Rambus 28G Multi-protocol LR SerDes PHY and the CryptoManager Root of Trust for its next-generation ASIC and FPGA designs

  2. Collins Aerospace And Lufthansa Technik Ink First-Of-Its-kind A380 Main Landing Gear MRO License And Asset Agreement

    Collins Aerospace Systems, a unit of United Technologies Corp. (NYSE:& sp;UTX), and Lufthansa Technik AG today announced a first-of-its-kind licensing and asset agreement for A380 main landing gear Maintenance Repair & Overhaul (MRO) services

  3. AAR And Alaska Airlines Announce New Digital Trial, Integration Of Airvolution® Repair Cycle Management

    AAR (NYSE: AIR), a leading provider of aviation services to commercial airlines and governments worldwide, announces that Alaska Airlines has signed on for a digital trial of Airvolution®, AAR's innovative cloud-based platform for efficient component repair cycle management

  4. Encore Semi And Trusted Semi Partner To Provide ‘Concept To Production Part’ Integrated Circuit Development Services To The Aerospace And Defense Market

    With over 45 years of combined advanced IC development expertise, Encore Semi and Trusted Semi have partnered to establish a world class engineering infrastructure to provide "Concept to Production Part" services for the aerospace and defense market

  5. TURBOTECH Revolutionizes Hybrid-Electric Aircraft With ANSYS

    TURBOTECH is leveraging ANSYS' (NASDAQ: ANSS) industry-leading simulation solutions to transform aeronautical propulsion

  6. General Plastics' To Promote Aerospace-Grade Core Materials And Built-To-Print Polyurethane Parts For The Business Aviation Industry At 2019 NBAA-BACE

    General Plastics Manufacturing Company, manufacturer of aerospace-grade rigid foam core materials and build-to-print polyurethane foam products will be at the NBAA Business Aviation Convention & Exhibition on October 22 – 24, 2019 in Las Vegas, NV, Booth #C11434

  7. Honeywell's T55 Engine Upgrade To Provide More Power, Better Fuel Efficiency For U.S. Army's CH-47 Chinook

    Honeywell (NYSE: HON) is finalizing a new and improved T55 engine to power the U.S. Army's Chinook helicopters. The newest upgrade for the legendary T55 will offer over 20% more power at sea level, a nearly 10% power increase at high and hot altitudes, and use 9% less fuel than before

  8. PIC Wire & Cable Launches New Machforce Connector Product Line At AUSA

    PIC Wire & Cable® – A Division of The Angelus Corporation, specializing in aerospace and defense interconnects, is proud to announce the launch of new 10G Ethernet connectors product line MACHFORCE at AUSA: Annual Meeting in Washington, DC, from October 14-16 in booth 1960

  9. EIZO Releases Chip Down NVIDIA Quadro P2000 (GP107) 3U VPX Graphics/GPGPU Card For Rugged Mil/Aero Applications

    EIZO Rugged Solutions Inc., a provider of ruggedized graphics and video products, has introduced the Condor GR5-P2000 3U VPX graphics and GPGPU card, offering exceptional graphics and GPGPU capability while delivering up to 2.3 TFLOPS of CUDA® processing power.

  10. ES Components Announces DLA MIL-PRF-38535 Certification

    ES Components (Eastern States Components, LLC), a niche distributor and manufacturer of microelectronic components for Military/Aerospace and High Reliability markets, today announced full certification by Defense Logistics Agency Land and Maritime (“DLA”) for MIL-PRF-38535 Class Q specification, QML-38535 listing and laboratory suitability compliance to MIL-STD-883 test standards for producing monolithic integrated circuits