High Density, Low Profile Mezzanine Connectors For High Reliability Applications Introduced

Hudson, MA - Smiths Interconnect, part of the global technology company Smiths Group, announced recently that Hypertronics Corporation has introduced the KFT Connector Series, a 0.050 in (1.27mm) fine pitch, high density rectangular connector utilizing 0.40mm diameter Hyperboloid sockets. With a 0.343 in. (8.71mm) stacking height, this low profile, dual row in-line interconnect solution is ideal for stacking and can be used in areas where board real estate is at a premium.

KFT connectors, like all Hypertronics connectors, are engineered to allow for top performance under all dynamic environmental conditions. KFT connectors provide immunity to shock and vibration fretting, numerous linear paths of contact, and a self-wipe action that consistently results in better signal integrity. Designed with 30 percent glass filled liquid crystal polymer (LCP) insulators and potted contacts, KFT connectors withstand the high temperatures associated with soldering. The LCP insulators also exceed NASA space requirements for outgassing and have inherent keying features to prevent improper mating.

"We designed the KFT using the high performance Hypertac technology, to be smaller in size and weight with the capacity for high pin count to accommodate tightly spaced board designs" stated Vadim Radunksy, President.

SOURCE: Smiths Interconnect